Intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systems
AssigneeShenzhen STS Microelectronics Co., Ltd.
InventorsQiao CHEN, Nannan ZHENG, Ming Yeu HUANG
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AssigneeShenzhen STS Microelectronics Co., Ltd.
InventorsQiao CHEN, Nannan ZHENG, Ming Yeu HUANG
Estimating the term…
The present disclosure relates to intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systems. An intra-cooling device for a power module is provided, comprising: a top insulating part formed by integrally fabricating, including: a top cap, and at least one first heat conductor disposed on an inner surface of the top cap and extending in a direction perpendicular to the inner surface of the top cap; and a bottom insulating part formed by integrally fabricating, including: a box composed of a bottom cap and a plurality of sidewalls surrounding the bottom cap, and at least one second heat conductor disposed on an inner surface of the bottom cap and extending in a direction perpendicular to the inner surface of the bottom cap; wherein the top insulating part and the bottom insulating part are assembled together in such a manner that the inner surface of the top cap and the inner surface of the bottom cap face each other, thereby forming a cavity capable of accommodating a cooling liquid.
An intra-cooling device for a power module, the intra-cooling device comprising:
A power module comprising:
A method of manufacturing an intra-cooling device, comprising:
Dependencies are inferred from the claim text.