Electronic circuit device and method for manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorToshiyuki NAKAISO
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AssigneeMurata Manufacturing Co., Ltd.
InventorToshiyuki NAKAISO
Estimating the term…
An electronic circuit device is provided that includes a chip component, a circuit board, and a coating resin. The chip component is mounted on the circuit board, and a mounting surface of the circuit board is coated with the coating resin. A surface of an element substrate, a surface of an insulator layer, and a surface of the coating resin form a continuous surface. The electronic circuit device includes an insulator exposed portion where there is no element substrate due to exposure of the insulator layer when viewed in a stacking direction of the element substrate and the insulator layer. At least a part of a coil opening by a coil conductor is in a region of the insulator exposed portion.
An electronic circuit device comprising:
A method for manufacturing an electronic circuit device, the method comprising:
Dependencies are inferred from the claim text.