Electronic device and method for manufacturing the same

Abstract

The present disclosure provides an electronic device and a method for manufacturing the same, in which the method includes the following steps. A substrate structure is provided, wherein the substrate structure includes a first substrate and a second substrate. A first anti-warpage layer is provided on at least one side of the substrate structure. A first circuit structure is formed on the first substrate. A packaging structure is formed on the first circuit structure, wherein the first substrate is disposed between the first circuit structure and the second substrate, and the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the second substrate.

Dependencies are inferred from the claim text.