Circuit board
AssigneeChipbond Technology Corporation
InventorsPei-Yi Wang, Shih-Chuan Lee, Chien-Hung Chiu
Life of this patent
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AssigneeChipbond Technology Corporation
InventorsPei-Yi Wang, Shih-Chuan Lee, Chien-Hung Chiu
Estimating the term…
A circuit board includes a substrate, a circuit layer, a solder resist layer, and at least one moisture barrier layer. The circuit layer is provided on the substrate and covered by the solder resist layer. Inner and outer leads of the circuit layer are not covered by the solder resist layer. The moisture barrier layer covers the solder resist layer such that the circuit layer and the solder resist layer are located between the substrate and the moisture barrier layer. The moisture barrier layer is provided to block liquid or moisture such that liquid or moisture cannot permeate to the solder resist layer and the circuit layer to cause corrosion or oxidation of the circuit layer.
A circuit board comprising:
Dependencies are inferred from the claim text.