US 2026/0096010 A1 · GRAPHICS PROCESSING SUBSYSTEMS WITH DUAL BLOW-THROUGH ARCHITECTURES

Graphics processing subsystems with dual blow-through architectures

AssigneeNVIDIA Corporation

InventorsXiangyang AN, Siarhei MURAUYOU, Yunseok KIM, Rikun JI, Andrew BELL, Boris LANDWEHR, Gabriele GORLA, Jaekyu JUNG, Jungho NA, Malcolm GUTENBURG, Xiang SUN, Mykola GROMOV, Sien CHEN, Zhenguang HUANG, Xuan WANG, Xin YANG, Xiang ZHU

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Abstract

Example graphics processing subsystems and computing devices that include the graphics processing subsystem(s) are described. In one example, the graphics processing subsystem may comprise a first fan, a second fan and a printed circuit board (PCB) on which a processor is disposed. The first fan may be associated with a first axis about which the first fan is rotatable. The second fan may be associated with a second axis about which the second fan is rotatable. The PCB may be shaped and positioned such that (a) a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, and (b) a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan. The first airflow path and the second airflow path are substantially linear relative to the respective first axis and second axis.

Claims20

Dependent claims

A graphics processing subsystem, comprising:

a first fan that is associated with a first axis about which the first fan is rotatable;
a second fan that is associated with a second axis about which the second fan is rotatable;
and
a printed circuit board (PCB) on which a processor is disposed, wherein the PCB is shaped and positioned such that:
a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, the first airflow path being substantially linear relative to the first axis;
and
a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan, the second airflow path being substantially linear relative to the second axis.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/923,648Filed 22 Oct 2024

Priority

WO PCT/CN2024/12242429 Sep 2024

Published

2 Apr 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

G06F 1/20
Constructional details or arrangements: cooling means
H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 2201/064
Thermal details: fluid cooling, e.g. by integral pipes
H05K 2201/066
Thermal details: heatsink mounted on the surface of the printed circuit board [PCB]