Microphone module, speaker module and communication device

A speaker module, comprising:

• a carrying structure, comprising a carrying part and an assembly part, wherein the assembly part is connected to the carrying part;
• a speaker assembly, configured on the carrying part and comprising a speaker body part and a buffer structure, wherein the buffer structure comprises a buffer part, the buffer part is located on a first surface of the speaker body part, and the assembly part penetrates the buffer part;
• and
• a screwing member, screwed on the assembly part, wherein the buffer part is sandwiched between the screwing member and the first surface of the speaker body part.

A communication device, comprising:

• a first cover;
• a microphone module, comprising a carrying structure and a microphone assembly, wherein the carrying structure is formed on the first cover and comprises a carrying part and two supporting parts, the two supporting parts are connected to the carrying part, the microphone assembly comprises a microphone body part and two hanging parts, the microphone body is suspended on the carrying part, and the two hanging parts are respectively connected to two opposite sides of the microphone body part and hung on the two supporting parts respectively;
• and
• a speaker module, comprising another carrying structure, a speaker assembly, and a screwing member, wherein the another carrying structure is formed on the first cover and comprises another carrying part and an assembly part, the assembly part is connected to the another carrying part, the speaker assembly is configured on the another carrying part, and comprises a speaker body part and a buffer structure, the buffer structure comprises a buffer part, the buffer part is located on a first surface of the speaker body part, the assembly part penetrates the buffer part, the screwing member is screwed on the assembly part, and the buffer part is sandwiched between the screwing member and the first surface of the speaker body part.