Multi-chip module with shielding plate for lna input matching

A packaged module comprising:

• a packaging substrate;
• and
• a multi-chip module including a plurality of layers including a first layer, a second layer and a third layer, said second layer positioned between the first layer and third layer;
• a low noise amplifier circuit distributed across the plurality of layers and including a first inductor in the first layer and a transistor;
• and a shielding plate spanning at least a portion of the second layer and overlapping at least a portion of the first inductor when viewed from a direction perpendicular to the plurality of layers, said shielding plate being electrically connected to a source terminal or emitter terminal of the transistor.

A wireless device comprising:

• an antenna configured to receive a radio frequency signal;
• a front end module in communication with the antenna, the front end module including a multi-chip module including a plurality of layers including a first layer, a second layer and a third layer, said second layer positioned between the first layer and third layer;
• a low noise amplifier circuit distributed across the plurality of layers and including a first inductor in the first layer and a transistor;
• and a shielding plate spanning at least a portion of the second layer and overlapping at least a portion of the first inductor when viewed from a direction perpendicular to the plurality of layers, said shielding plate being electrically connected to a source terminal or emitter terminal of the transistor;
• and
• a transceiver in communication with the front end module.