Elastic Wave Device and Communication Module Including the Elastic Wave Device

Abstract

An elastic wave device is disclosed, which includes a wiring substrate; a device chip mounted on the wiring substrate via a plurality of bumps, the device chip having a resonator; a metal pattern formed in an outer edge portion of the wiring substrate; a plurality of bump pads formed on the wiring substrate and including an antenna pad, a transmission pad, a reception pad, and a ground pad; a solder resist layer bonded to both the metal pattern and the wiring substrate; a sealing portion disposed on the wiring substrate and penetrating between the wiring substrate and the device chip to hermetically seal the device chip; wherein the solder resist layer is bonded to the sealing portion.

Dependencies are inferred from the claim text.