Loading mechanisms for land grid array packages

A loading mechanism for a land grid array (LGA) semiconductor package, comprising:

• a backplate configured to attach to a motherboard;
• a socket attached to the motherboard opposite the backplate, the socket configured to receive a LGA semiconductor package;
• and
• a load plate configured to hold the LGA semiconductor package in the socket, the load plate removably coupled to the backplate, the load plate including:
• contact interfaces extending from the load plate and configured to contact the LGA semiconductor package when the LGA semiconductor package is in the socket, each contact interface of the contact interfaces configured to engage a different side of the LGA semiconductor package;
• and
• spring elements configured to provide mechanical tolerances in one or more of the loading mechanism, the LGA semiconductor package, or the socket.