Substrate processing equipment and icp antenna module therefor

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing by forming plasma with an induced electric field, and an ICP antenna module used therein. The present invention discloses an ICP antenna module comprising: a first antenna coil part, one end of which is connected to a matcher; a second antenna coil part, the other end of which is grounded; and a phase changing circuit part, one end of which is connected to the other end of the first antenna coil part and the other end of which is connected to one end of the second antenna coil part, wherein the phase changing circuit part changes a phase of a first current flowing through the first antenna coil part to a second current having a phase opposite to the first current.

Dependencies are inferred from the claim text.