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US 2026/0094768 A1Published application
Electronic component, electronic component device, and method for producing electronic component
AssigneeTDK Corporation
InventorsKazuyuki Hasebe, Yuki Okafuji, Yasuhiro Okui, Ken Morita, Noriyuki Inoue
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Abstract
An electronic component includes an element body and an external electrode. The external electrode is disposed on the element body, and includes a conductive resin layer and a plating layer formed on the conductive resin layer. The external electrode has a hole formed from a surface of the plating layer and reaching the conductive resin layer.
Claims13
An electronic component comprising:
- an element body;
- and
- an external electrode disposed on the element body and including a conductive resin layer and a plating layer formed on the conductive resin layer, wherein
- the external electrode has a hole formed from a surface of the plating layer and reaching the conductive resin layer.
1 more element
An electronic component device comprising:
- an electronic component;
- and
- an electronic device on which the electronic component is solder-mounted, wherein
- the electronic component includes:
- an element body;
- and
- an external electrode disposed on the element body and including a conductive resin layer and a plating layer formed on the conductive resin layer,
- the external electrode has a hole formed from a surface of the plating layer and reaching the conductive resin layer, and
- the hole is exposed from a solder.
6 more elements
A method for producing an electronic component, the method comprising:
- preparing an element body on which an external electrode is formed, the external electrode including a conductive resin layer and a plating layer formed on the conductive resin layer;
- and
- forming a hole in the external electrode, the hole reaching the conductive resin layer from a surface of the plating layer.
Dependencies are inferred from the claim text.