Stacking of heat-generating devices and heat-rejecting media

Abstract

A system may include a first electronic device mechanically and electrically mounted on a first circuit board, a second electronic device mechanically and electrically mounted on a second circuit board, heat-rejecting media, first mechanical mounting features formed on the heat-rejecting media and on the first circuit board mechanically spring coupling the heat-rejecting media to the first circuit board in order to thermally couple the first electronic device to a first surface on a first side of the heat-rejecting media, and second mechanical mounting features formed on the second circuit board and on one of either of the first circuit board and the heat-rejecting media and mechanically spring coupling the second circuit board to one of either the heat-rejecting media and the first circuit board in order to thermally couple the second electronic device to a second surface on a second side of the heat-rejecting media opposite the first side.

Dependencies are inferred from the claim text.