Substrate processing method
AssigneeSemes Co., Ltd.
InventorsTae Shin KIM, Seryeyohan CHO, Young Dae CHUNG
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AssigneeSemes Co., Ltd.
InventorsTae Shin KIM, Seryeyohan CHO, Young Dae CHUNG
Estimating the term…
Provided is a method of processing a substrate, the method including: process preparing operation of setting a pattern of a laser emitted to a substrate; and after the process preparing operation, a process processing operation of processing the substrate by irradiating the substrate with the laser, in which the process preparing operation includes: a distortion amount acquiring operation of acquiring a distortion amount of an irradiation pattern by irradiating a preset irradiation region with the irradiation pattern which has been generated from a laser source and modulated by a light modulation unit; and a distortion correcting operation of generating a correction pattern based on the distortion amount acquired in the distortion amount acquiring operation and inputting the correction pattern to a light modulation unit, and the process processing operation includes a heating operation of heating the substrate by irradiating the substrate with the correction pattern.
A method of processing a substrate, the method comprising:
A method of processing a substrate, the method comprising:
A method of processing a substrate, the method comprising:
Dependencies are inferred from the claim text.