Substrate embedded optical chiplet for integrated photonic interconnects

A method for fabricating an optoelectronic device, the method comprising:

• receiving a substrate having (i) a surface, and (ii) a recess formed in the substrate and extended from the surface into the substrate;
• disposing, within the recess of the substrate, an optical chiplet being embedded within the substrate mounting, out of the substrate, an integrated circuit (IC) chip facing the surface of the substrate;
• and
• mounting, on the substrate, an optical connector;
• wherein the optical chiplet being configured to:
• exchange (i) optical signals with the optical connector, and (ii) electrical signals with the integrated circuit (IC) chip, and
• convert between the optical signals and the electrical signals.