Package for encapsulating a photonic integrated circuit (pic)

Abstract

A package for encapsulating a photonic integrated circuit, PIC, the package comprising: a cavity for receiving the PIC, the cavity defined by interior walls of the package; a light propagating portion made of a semiconductor material comprising a light inlet, a light outlet and a light reflecting surface, the light inlet formed by an interior wall of the package that faces a light outlet of the PIC, said interior wall arranged at a semi-perpendicular angle with respect to light exiting the PIC, to allow said light to enter into the light propagating portion of the package, the light reflecting surface arranged at a transverse angle with respect to the propagation direction of the light exiting the PIC so that the light reflecting surface reflects incoming light towards the light outlet; the light outlet formed by an outer surface of the package.

Dependencies are inferred from the claim text.