Interposer Assembly for System-Level Failure Analysis

Abstract

This document describes systems and techniques directed at an interposer assembly for system-level failure analysis. In aspects, the interposer assembly may include a main body with a central aperture configured to provide optical access to an exposed surface of a semiconductor device. A plurality of probe pins may be arranged on the main body surrounding the central aperture, the plurality of probe pins configured to make electrical contact with a corresponding plurality of fine-pitch contact pads on the semiconductor device. The interposer assembly may further include at least one connector disposed on the main body and physically offset from the central aperture configured to receive a memory module. Circuitry within the main body electrically couples the plurality of probe pins to the at least one connector. In such a configuration, accurate optical imaging and fault isolation analysis can be enabled while a semiconductor device is fully operational.

Dependencies are inferred from the claim text.