Test Socket for Enhancing Integrated Circuit Testing and Its Manufacturing Method

Abstract

A test socket for integrated circuit (IC) testing and a method of manufacturing the test socket are provided. The test socket includes an insulating support structure having a plurality of through holes and a plurality of elastic conductive columns. These conductive columns are partially embedded in the support structure and extend through the through holes to accommodate variations caused by IC package warpage and tolerances in BGA solder ball dimensions. The insulating support structure further includes grooves located adjacent to the through holes, which enhance the compressibility and heat dissipation capability of the test socket. The conductive columns themselves have an elastic structure, with at least a portion of their surfaces covered by an insulating material layer to prevent short circuits. The test socket also features a rigid support frame—made of polyimide, PCB material, or ceramic—and a soft support frame made of silicone, offering both durability and flexibility.

Dependencies are inferred from the claim text.