Sensor Module

Abstract

A sensor module includes a sensor substrate including a circuit substrate and an inertial sensor mounted on the circuit substrate, a package including a main body portion having a first surface and a second surface in a front-back relationship and a side surface coupling the first surface and the second surface and housing the sensor substrate inside, and a flexible wiring portion electrically coupled to the sensor substrate and extending from the side surface to an outside of the package, wherein the package has a first screw insertion hole penetrating the first surface and the second surface, and is fixed to an object by a screw inserted through the first screw insertion hole.

Dependencies are inferred from the claim text.