Plating apparatus control method and plating apparatus

A plating apparatus comprising multiple plating modules and a controller, wherein the controller is constructed to:

• obtain plating-film-thickness measurement data of multiple substrates, wherein the multiple substrates are those with respect to which plating processes applied thereto by the multiple plating modules have been completed;
• determine a degree of quality of each plating module in the multiple plating modules, based on the plating-film-thickness measurement data;
• and
• control a plating process in the plating apparatus, based on the degree of quality of each plating module.

A plating apparatus comprising multiple plating modules and a controller, wherein the controller is constructed to:

• determine, based on a predetermined plating process condition, an expected score relating to quality of thickness of a plating film which is to be formed when a plating process is performed in accordance with the plating process condition, and
• control, based on the expected score obtained as a result of above determination, selection of a plating module which is to be used to perform the plating process;
• wherein the controller comprise a learning model which is trained by machine learning to make it output the expected score when the predetermined plating process condition is inputted, and
• the controller determines, by using the learning model and based on the predetermined plating process condition, the expected score.