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US 2026/0090482 A1Published application
Power module package
AssigneeSemiconductor Components Industries, LLC
InventorsHangil SHIN, Jihwan KIM, Taekyun KIM, Seungwon IM
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Abstract
An electronic power module is disclosed that forms external electrical connections without the use of a lead frame. Instead, various types of external connectors can be used, such as a press-fit pin assembly and an integrated connection post and power tap. Different methods of securing the external connectors to a multilayer substrate are also disclosed.
Claims27
A power module, comprising:
- a substrate including a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer;
- a connection post coupled to the first conductive layer;
- a conductive sheath coupled to the first conductive layer, the conductive sheath configured to receive an external connector;
- a die coupled to the first conductive layer;
- and
- a non-conducting material encapsulating the die, at least a portion of the connection post, and the conductive sheath.
3 more elements
A method of forming a power module, the method comprising:
- adhering a multilayer substrate to a carrier, the multilayer substrate including a first conductive layer, a second conductive layer, and an insulating layer;
- disposing an external connector in a first conductive layer of the multilayer substrate;
- attaching a die to the first conductive layer;
- encapsulating the die and the external connector;
- detaching the carrier from the multilayer substrate;
- and
- singulating the multilayer substrate.
4 more elements
A package for an embedded semiconductor die, the package comprising:
- a multilayer substrate supporting the embedded semiconductor die;
- an encapsulant surrounding the embedded semiconductor die;
- and
- a plurality of electrical connections coupling the embedded semiconductor die to the multilayer substrate, the plurality of electrical connections including:
- a conductive material coupled to a surface layer of the multilayer substrate;
- a connection post embedded in the surface layer;
- and
- a press-fit pin assembly embedded in the surface layer, the press-fit pin assembly including a conductive sheath.
5 more elements
Dependencies are inferred from the claim text.