Self-extendable interconnect structures for surface mount semiconductor devices

A semiconductor device, comprising:

• a wiring substrate;
• a chip on a first surface of the wiring substrate;
• a plurality of mounting posts on a second surface of the wiring substrate, each mounting post extending from the second surface in a first direction substantially orthogonal to the second surface;
• and
• a solder ball on an end of each mounting post farthest from the wiring substrate in the first direction, wherein
• each mounting post has a solder reservoir space therein, and
• at least one solder reservoir space has solder therein.

An electronic device, comprising:

• a circuit board with a plurality of mounting pads at a surface thereof;
• and
• a semiconductor device soldered to the plurality of mounting pads, wherein
• the semiconductor device comprises:
• a wiring substrate;
• a chip on a first surface of the wiring substrate;
• and
• a plurality of protruding structures on a second surface of the wiring substrate, and
• each protruding structure includes a solder reservoir space therein.