Electronic devices and methods of manufacturing electronic devices

A method of manufacturing an electronic device, comprising:

• providing a first substrate comprising a first substrate first side, a first substrate second side opposite the first substrate first side, a first dielectric structure, and a first conductive structure;
• providing a second substrate comprising a second substrate first side and a second substrate second side opposite the second substrate first side;
• providing a first inner electronic component coupled to the first conductive structure proximate to the first substrate second side;
• providing an outer electronic component coupled to the first conductive structure proximate to the first substrate first side, the outer electronic component comprising:
• a body;
• and
• a groove in the body configured to couple with an external interconnect;
• and
• providing inner interconnects coupling the first substrate to the second substrate;
• wherein:
• the first substrate, the second substrate, the first inner electronic component, and the outer electronic component are in a stacked configuration;
• the first inner electronic component is interposed between the first substrate and the second substrate;
• the first substrate comprises an outer edge;
• a portion of the body extends past the outer edge to define a ledge portion;
• and
• the groove is in the ledge portion.