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US 2026/0090468 A1Published application
Electronic assembly and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYU-HSUN LI
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Abstract
A method of fabricating an electronic assembly, includes steps of providing a stacked structure comprising an interposer and at least one heat generating device disposed over the substrate; forming a plurality of supporters on the interposer and laterally surround the heat generating device; forming a plurality of adhesive members on the supporters; and attaching a fluid-agitating device onto the adhesive members.
Claims20
A method of fabricating an electronic assembly, comprising:
- providing a stacked structure comprising an interposer and at least one heat generating device disposed over and electrically connected to the interposer;
- forming a plurality of supporters on the interposer and laterally surround the heat generating device;
- and
- attaching a fluid-agitating device onto the plurality of supporter,
- wherein the fluid-agitating device and the heat generating device at least partially overlap.
2 more elements
A method of fabricating an electronic assembly, comprising:
- providing an interposer;
- attaching a heat generating device to the interposer;
- and
- mounting a fluid-agitating device on the interposer, wherein the fluid-agitating device comprises an accelerometer above the heat generating device.
1 more element
An electronic assembly, comprising:
- an interposer;
- a heat generating device disposed over the interposer;
- a plurality of supporters disposed on the interposer;
- and
- a fluid-agitating device attached to the supporters,
- wherein the fluid-agitating device and the heat generating device at least partially overlap.
3 more elements
Dependencies are inferred from the claim text.