Technologies for a stacked integrated circuit package

An apparatus comprising:

• an integrated circuit package comprising:
• means for mounting one or more integrated circuit dies, wherein the means for mounting one or more integrated circuit dies has a first area;
• and
• means for interfacing with an array of electrical contacts on a motherboard, wherein the means for interfacing with the array of electrical contacts on the motherboard has a second area, wherein the second area is less than the first area.

A method comprising:

• manufacturing a first plurality of circuit boards, wherein individual circuit boards of the first plurality of circuit boards comprise a first side and a second side opposite the first side;
• mounting one or more integrated circuit dies on the first side of individual circuit boards of the first plurality of circuit boards;
• manufacturing a second plurality of circuit boards, wherein individual circuit boards of the second plurality of circuit boards comprise a first side and a second side opposite the first side, wherein an array of electrical contacts is mounted on the second side to interface with a first motherboard socket type;
• manufacturing a third plurality of circuit boards, wherein individual circuit boards of the third plurality of circuit boards comprise a first side and a second side opposite the first side, wherein an array of electrical contacts is mounted on the second side to interface with a second motherboard socket type, wherein the second motherboard socket type is different from the first motherboard socket type;
• mounting individual circuit boards of the second plurality of circuit boards to individual circuit boards of the first plurality of circuit boards to create a first plurality of integrated circuit packages;
• and
• mounting individual circuit boards of the third plurality of circuit boards to individual circuit boards of the first plurality of circuit boards to create a second plurality of integrated circuit packages.