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US 2026/0090460 A1Published application
Integrated device package lids with compliant features
AssigneeQUALCOMM Incorporated
InventorsLuis Eduardo DE LOS HEROS BEUNZA, Julian Eduardo CASTILLO CHACON, Brian ROGGEMAN
Life of this patent
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Abstract
An integrated device package includes a substrate and a die coupled to the substrate. The integrated device package also includes a thermal interface material coupled to the die, and a lid coupled to the substrate and to the thermal interface material. The lid includes a unitary body that includes one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.
Claims20
An integrated device package comprising:
- a substrate;
- a die coupled to the substrate;
- a thermal interface material coupled to the die;
- and
- a lid coupled to the substrate and to the thermal interface material, the lid comprising a unitary body including one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.
2 more elements
A device comprising:
- a printed circuit board;
- and
- an integrated device package electrically connected to the printed circuit board, the integrated device package comprising:
- a substrate;
- a die coupled to the substrate;
- a thermal interface material coupled to the die;
- and
- a lid coupled to the substrate and to the thermal interface material, the lid comprising a unitary body including one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.
5 more elements
A method of fabricating an integrated device package, the method comprising:
- coupling a die to a substrate;
- coupling a thermal interface material to the die;
- and
- coupling a lid to the substrate and to the thermal interface material, the lid comprising a unitary body including one or more openings defining a die contact area of the unitary body and one or more compliant members of the unitary body.
1 more element
Dependencies are inferred from the claim text.