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US 2026/0090449 A1Published application
Semiconductor Package
AssigneeNexperia B.V.
InventorsIlyas Dchar, Ricardo Lagmay Yandoc, Adam Brown, Michael Becker
Life of this patent
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Abstract
The present disclosure relates to a semiconductor package, in particular to a top-side cooled semiconductor package. It is a goal of the present disclosure to provide an improved semiconductor package that enables either a better control of TIM thickness while ensuring a proper electrical insulation between the exposed metal pad of the power package and the heatsink, or to control or protect a correct solder thickness between the exposed drain terminal of the package and the PCB footprint or heatsink.
Claims18
A semiconductor package comprising:
- a lead frame made from an electrically conductive metal material and at least two terminals;
- at least one semiconductor die structure having a first die side and a second die side opposite to the first die side and mounted with the second die side on the lead frame;
- a plurality of connections electrically and mechanically connecting the at least one semiconductor die structure with the at least two terminals of the lead frame;
- at least one heat sink pad mounted to the first die side of the semiconductor die structure;
- and
- a moulding resin encapsulating the lead frame, the at least one semiconductor die structure, the plurality of connections, the at least one heat sink pad and the at least two terminals leaving at least a portion of the heat sink pad and at least a portion of the at least two terminals exposed, and forming the semiconductor package having a heat sink pad package surface side and a lead frame package surface side, wherein the moulding resin at the heat sink pad package surface side and/or the lead frame package surface side have at least one resin spacer element extending from the respective package surface side.
3 more elements
Dependencies are inferred from the claim text.