Semiconductor device and semiconductor apparatus
AssigneeFujian Jinhua Integrated Circuit Co., Ltd.
InventorXiaobing CHEN
Life of this patent
Estimating the term…
Loading patent…
AssigneeFujian Jinhua Integrated Circuit Co., Ltd.
InventorXiaobing CHEN
Estimating the term…
The present application provides a semiconductor device and a semiconductor apparatus. The semiconductor device includes a substrate, a capacitor structure, a semiconductor conductive layer, a cover layer, and multiple voids; where the capacitor structure is disposed on the substrate; the capacitor structure includes multiple capacitors; the semiconductor conductive layer includes a first portion and a second portion, the first portion covers the capacitor structure and directly contacts the capacitor structure; the second portion is filled between adjacent capacitors; the cover layer is located on the first portion and is in direct contact with the first portion; a surface of the cover layer facing the semiconductor conductive layer has an undulating surface profile, and the surface profile has peaks and valleys, the first portion being extended into the valleys; at least one void is located within the first portion in the valley.
A semiconductor device, comprising:
A semiconductor apparatus, comprising a package and a semiconductor device, and the package encapsulates the semiconductor device, wherein the semiconductor device comprises:
Dependencies are inferred from the claim text.