Semiconductor device and associated method in a fan-out wafer level chip scale package

A method of manufacturing a semiconductor device, the method comprising:

• (i) constructing an assembly, wherein constructing the assembly comprises:
• (a) disposing a leadframe on a temporary substrate, the leadframe comprising at least a plurality of substantially parallel conductive walls;
• (b) disposing a plurality of semiconductor dies on the temporary substrate, each of the plurality of semiconductor dies disposed with its active layer against the temporary substrate, the plurality of semiconductor dies comprising a plurality of subgroups of semiconductor dies, each subgroup of semiconductor dies is disposed on the temporary substrate such that a same side of each of the plurality of semiconductor dies in each subgroup of semiconductor dies is adjacent a corresponding one of the plurality of substantially parallel conductive walls;
• (c) enclosing the leadframe and the plurality of semiconductor dies in a molding compound;
• (d) removing the temporary substrate;
• (e) disposing a plurality of redistribution layers on the active layer of corresponding ones of the plurality of semiconductor dies such that each of the plurality of redistribution layers provides a plurality of electrical connections to a corresponding one of the plurality of semiconductor dies, each of the plurality of redistribution layers at least partially embedded in a dielectric layer;
• and
• (f) disposing a plurality of solder balls on each of the plurality of redistribution layers, each of the plurality of solder balls providing an electrical connection to a corresponding connection point of a corresponding one of the plurality of semiconductor dies;
• and
• (ii) singulating the assembly into a plurality of fan-out wafer-level chip scale packages (FO-WLCSP), each FO-WLCSP comprising a corresponding one of the plurality of semiconductor dies, a corresponding one of the plurality of redistribution layers, corresponding ones of the plurality of solder balls, and a portion of a corresponding one of the plurality of substantially parallel conductive walls.