Ic packages with substrates having glass cores with large footprints, thin redistribution layers, and electrical components

An apparatus comprising:

• a substrate comprising a glass core, the glass core comprising a first surface and a second surface opposite the first surface;
• an electrical component within a region of the glass core between the first and second surfaces;
• a first redistribution layer on the first surface, and a second redistribution layer on the second surface, the first redistribution layer comprising a plurality of first metallization layers, the second redistribution layer comprising a plurality of second metallization layers, wherein each of the first and second metallization layers comprises a thickness in a range of 0.1 μm to 10 μm;
• and
• a through-glass via extending between the first and second surfaces, wherein the through-glass via contacts a first metal feature in the first redistribution layer and a second metal feature in the second redistribution layer.

A system, comprising:

• a substrate comprising a glass layer, the glass layer comprising a first surface and a second surface opposite the first surface;
• a first redistribution layer (RDL) adjacent to the first surface, and a second RDL adjacent to the second surface, wherein the first RDL comprises a thickness of 100 μm or less;
• at least one through-glass via extending between the first and second RDL;
• an integrated circuit (IC) die bonded to metal features over the first RDL;
• and
• a power supply coupled to the substrate to power the IC die.