Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portions

An apparatus comprising:

• an integrated circuit package substrate comprising:
• a glass layer having a first thickness;
• a first plurality of buildup layers above the glass layer;
• a second plurality of buildup layers below the glass layer;
• and
• a protrusion extending from the glass layer, the protrusion having a second thickness that is smaller than the first thickness.

A system comprising:

• a glass core;
• a plurality of through glass vias formed through the glass core;
• at least one first dielectric layer above the glass core;
• at least one second dielectric layer below the glass core;
• and
• a glass protrusion extending in a horizontal direction from the glass core, wherein the glass protrusion is thinner than the glass core.