Semiconductor package including a conductive post

A semiconductor package, comprising:

• a first redistribution substrate;
• a semiconductor chip on the first redistribution substrate;
• a conductive post on the first redistribution substrate and horizontally spaced apart from the semiconductor chip;
• a mold layer provided on the first redistribution substrate and on a side surface of the semiconductor chip;
• and
• a first interface layer between the mold layer and a side surface of the conductive post,
• wherein the side surface of the conductive post has a first surface roughness,
• a top surface of the conductive post has a second surface roughness, and
• the second surface roughness is smaller than the first surface roughness.

A semiconductor package, comprising:

• a first redistribution substrate including first insulating layers and first redistribution patterns, which at least partially penetrate the first insulating layers;
• a semiconductor chip on the first redistribution substrate;
• a conductive post on the first redistribution substrate and horizontally spaced apart from the semiconductor chip, a side surface of the conductive post defined by protruding portions;
• a mold layer provided on the first redistribution substrate and a side surface of the semiconductor chip;
• a first interface layer between the mold layer and the protruding portions of the conductive post and between the mold layer and at least a portion of a top surface of the first redistribution substrate;
• a second redistribution substrate provided on the mold layer and electrically connected to the conductive post, the second redistribution substrate including second insulating layers and second redistribution patterns, which at least partially penetrate the second insulating layers;
• and
• an outer coupling terminal on a bottom surface of the first redistribution substrate,
• wherein the conductive post electrically connects the first redistribution patterns and the second redistribution patterns to each other.