Package with side-wettable structure formed on via walls

A package with a side-wettable structure formed on via walls, comprising:

• a composite substrate having a conductive layer on an exterior of the composite substrate and an accommodating space in an interior of the composite substrate;
• a die mounted in the accommodating space;
• a molding layer covering the composite substrate and filling the accommodating space to wrap the die;
• an upper redistribution layer mounted on the molding layer;
• a solder mask covering the upper redistribution layer and exposing at least one edge of the upper redistribution layer to form at least one edge bonding surface;
• and
• at least one conductive contact formed by cutting at least one conductive via and located adjacent to at least one edge of the composite substrate, and each conductive contact correspondingly and electrically connected with each edge bonding surface and the conductive layer of the composite substrate respectively;
• wherein each conductive contact comprises a cutting surface including a side surface of the upper redistribution layer and connected with the at least one edge bonding surface, and an anti-oxidation conductive layer is mounted on each bonding surface and the cutting surface of each conductive contact.