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US 2026/0090410 A1Published application
Embedded channels in a glass core
AssigneeIntel Corporation
InventorsJeremy D. ECTON, Jefferson Kaplan, Brandon C. MARIN, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN
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Abstract
Embodiments disclosed herein include an apparatus that includes a substrate with an edge surface. In an embodiment, the substrate includes a glass layer, and a via is formed through a thickness of the substrate. In an embodiment, a recess is formed into the edge surface. In an embodiment, a height of the recess measured in a direction from a bottom of the substrate to a top of the substrate is greater than a depth of the recess.
Claims20
An apparatus, comprising:
- a substrate with an edge surface, wherein the substrate comprises a glass layer;
- a via through a thickness of the substrate;
- and
- a recess into the edge surface, wherein a height of the recess measured in a direction from a bottom of the substrate to a top of the substrate is greater than a depth of the recess.
1 more element
An apparatus, comprising:
- a substrate, wherein the substrate comprises a glass layer;
- a recess into an edge surface of the substrate between a first surface of the substrate and a second surface of the substrate;
- a layer over the first surface of the substrate, wherein the layer comprises an organic dielectric material.
An apparatus, comprising:
- a package substrate, wherein the package substrate comprises:
- a glass core, wherein the glass core comprises an edge with a first portion that has a first surface roughness and a second portion that has a second surface roughness that is different than the first surface roughness;
- and
- an organic buildup layer over the glass core, wherein a bridge die is embedded in the organic buildup layer;
- and
- a first die and a second die that are both coupled to the package substrate, wherein the bridge die electrically couples the first die to the second die.
3 more elements
Dependencies are inferred from the claim text.