Semiconductor device

A semiconductor device comprising:

• at least one semiconductor element;
• a conductive support member;
• and
• a sealing resin covering the at least one semiconductor element and having a first resin side surface facing one side of a first direction perpendicular to a thickness direction,
• wherein the conductive support member comprises at least one first outer lead each including:
• a first root portion extending in the first direction from the first resin side surface;
• a first mount portion located on one side of the thickness direction relative to the first root portion;
• and a first extended portion connected to the first root portion via a first bent portion and connected to the first mount portion via a second bent portion,
• the first outer lead comprises:
• a first division including the first extended portion;
• a second division including the first root portion and connected to the first division;
• and a third division including the first mount portion and connected to the first division,
• a dimension of the first division in a second direction perpendicular to the thickness direction and the first direction is greater than a dimension of the second division in the second direction and a dimension of the third division in the second direction,
• at least either of a first division boundary and a second division boundary is located at the first extended portion, the first division boundary being a boundary between the first division and the second division, the second division boundary being a boundary between the first division and the third division.