Semiconductor device and vehicle

A semiconductor device comprising:

• a semiconductor element;
• a first lead including a die pad portion and a first terminal portion, the die pad portion including a first lead obverse surface facing a first side in a thickness direction and having the semiconductor element mounted thereon, and a first lead reverse surface facing a second side in the thickness direction;
• and
• a sealing resin including a first resin surface facing the first side in the thickness direction, a second resin surface facing the second side in the thickness direction, and a third resin surface facing a first side in a first direction perpendicular to the thickness direction, the sealing resin covering the semiconductor element and a part of the die pad portion,
• wherein the first lead includes a metal layer covering a part of the first terminal portion,
• the first lead reverse surface is exposed from the second resin surface,
• the first terminal portion includes a first-terminal base portion and at least one first-terminal tip portion,
• the first-terminal base portion passes through the third resin surface, and is spaced apart from the first resin surface in the thickness direction,
• the at least one first-terminal tip portion is offset to the first side in the thickness direction relative to the first-terminal base portion, and is used for mounting,
• the at least one first-terminal tip portion includes a first tip surface and a recessed surface connected to the first tip surface,
• the first tip surface is exposed from the metal layer, and
• the recessed surface is covered with the metal layer.