Semiconductor package substrate with a smooth groove straddling topside and sidewall

A method for fabricating a semiconductor package comprising:

• applying an adhesive including a resin to a roughened surface of a topside of a metallic substrate,
• wherein the metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface,
• wherein the groove straddles the topside and a sidewall of the metallic substrate,
• positioning a semiconductor die including bond pads on the metallic substrate in contact with the adhesive such that the groove is about a perimeter of the semiconductor die on the roughened surface;
• and
• curing the adhesive to bond the semiconductor die to the metallic substrate.