Semiconductor device and method of manufacturing the semiconductor device

A semiconductor device comprising:

• a first frame;
• a second frame arranged so as to face the first frame in a first direction and having a stepped portion on an end portion of an upper surface, the end portion being closer to the first frame;
• a first semiconductor chip arranged on a bottom surface of the stepped portion of the second frame;
• a wire configured to electrically couple the first semiconductor chip and the first frame;
• and
• a resin configured to cover part of each of the first frame and the second frame, and to seal the first semiconductor chip and the wire,
• wherein a lower surface of the first frame and a first side surface of the first frame, the first side surface being far from the second frame in the first direction, are exposed from the resin, and
• a lower surface of the second frame and a second side surface of the second frame, the second side surface being far from the first frame in the first direction, are exposed from the resin.