Dummy through vias for integrated circuit packages and methods of forming the same

A device comprising:

• an integrated circuit die comprising a die connector;
• an encapsulant encapsulating the integrated circuit die;
• a functional through via extending through the encapsulant;
• a dummy through via extending through the encapsulant, the dummy through via disposed between the functional through via and the integrated circuit die, the dummy through via having a greater width than the functional through via;
• and
• a redistribution structure over the dummy through via, the functional through via, and the encapsulant, the redistribution structure comprising a redistribution line, the redistribution line being coupled to the functional through via and to the die connector of the integrated circuit die, the redistribution line extending over the dummy through via.

A method comprising:

• forming a first conductive via and a second conductive via, the first conductive via having a greater width than the second conductive via;
• placing an integrated circuit die adjacent the first conductive via, the first conductive via disposed between the second conductive via and the integrated circuit die;
• encapsulating the integrated circuit die, the first conductive via, and the second conductive via with a molding compound;
• depositing a dielectric layer on the molding compound, the first conductive via, and the second conductive via;
• and
• forming a metallization pattern having a line portion and a via portion, the line portion extending along a surface of the dielectric layer and over the first conductive via, the via portion extending through the dielectric layer to couple the second conductive via and a die connector of the integrated circuit die.