Split processing of integrated circuit layers with high accuracy bonding

A computing device, comprising:

• a board;
• and
• a component coupled to the board, the component including an integrated circuit structure, comprising:
• a front-end-of-line (FEOL) stack having a surface including first conductive features and first dielectric features;
• and
• a back-end-of-line (BEOL) stack above the FEOL stack, the BEOL stack having a bottommost surface including second conductive features and second dielectric features in contact with corresponding ones of the first conductive features and first dielectric features of the surface of the FEOL stack, respectively, wherein the second conductive features are laterally offset from the corresponding first conductive features, or
• a backside stack below the FEOL stack, the backside stack having an uppermost surface including second conductive features and second dielectric features in contact with corresponding ones of the first conductive features and first dielectric features of the surface of the FEOL stack, respectively, wherein the second conductive features are laterally offset from the corresponding first conductive features.