Apparatus and method for treating wafers using guiding elements

An apparatus for treating wafers with a treatment liquid, comprising:

• a basin for receiving the treatment liquid and the wafers to be treated;
• a hole plate separating the basin in an upper area and a lower area, wherein the hole plate comprises holes that fluidically connect the lower area and the upper area, wherein the upper area comprises a receiving area for one or several wafer carriers in which wafers are each disposed side-by-side with a gap in between;
• and
• a filling pipe disposed in the lower area of the basin and comprising filling pipe openings along its longitudinal direction;
• further comprising guiding elements that are disposed in the upper area of the basin, in addition to outer walls of the basin, and laterally limit the receiving area of at least one wafer carrier to concentrate a flow of the treatment liquid on the receiving area,
• wherein the guiding elements extend from the hole plate to a height corresponding at least to the height of the at least one wafer carrier.