Electronic device and method of manufacturing electronic device

A method of manufacturing an electronic device, the method comprising:

• providing a display module including a display area, a non-display area disposed outside the display area, and a bending area disposed on one side of the non-display area and bent with respect to an imaginary bending axis extending in one direction;
• providing a protective layer including a main protective layer overlapping the display area and a sub-protective layer spaced apart from the main protective layer and overlapping at least a portion of the bending area;
• forming a bending protective part on the bending area;
• providing a reinforcing resin between the main protective layer and the sub-protective layer such that the reinforcing resin is disposed spaced apart from the main protective layer under the display module;
• temporarily curing the reinforcing resin;
• bending the bending area such that the temporarily cured reinforcing resin faces an inside;
• and
• forming a reinforcing layer by curing the temporarily cured reinforcing resin in a bent state.