Light emitting element and method for manufacturing the same

Abstract

A light emitting element and a method for manufacturing the light emitting element are provided. The method includes forming an epi layer with a plurality of grooves on a wafer, forming a plurality of assembly lines on the epi layer, self-assembling a plurality of light extraction particles into the grooves by applying a voltage to the assembly lines, and forming a plurality of light emitting elements by etching the assembly lines and the epi layer. The light extraction particles, which may include magnetic cores and scattering materials, are positioned using an electric field through dielectrophoresis. This self-assembly process enables precise placement of the light extraction particles within each groove and allows simultaneous formation across multiple devices. By integrating the light extraction members during fabrication and reusing the assembly lines as electrodes, the method simplifies processing, enhances uniformity of light emission, and improves luminance performance across various viewing angles.

Dependencies are inferred from the claim text.