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US 2026/0090153 A1Published application
Chip package and light-emitting device
AssigneeGuangzhou Luxvisions Innovation Technology Limited
InventorYi-Chih Lai
Life of this patent
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Abstract
A chip package includes a light-emitting diode chip, a reflective layer, and a microlens layer. The reflective layer surrounds the light-emitting diode chip. The microlens layer is disposed on the light-emitting diode chip and the reflective layer along a stacking direction and includes multiple microlenses arranged in an array. A light-emitting device is also provided.
Claims15
A chip package, comprising:
- a light-emitting diode chip;
- a reflective layer, surrounding the light-emitting diode chip;
- and
- a microlens layer, disposed on the light-emitting diode chip and the reflective layer along a stacking direction and comprising a plurality of microlenses arranged in an array.
1 more element
Dependencies are inferred from the claim text.