Image sensor

An image sensor comprising:

• a substrate including a pixel area with a plurality of pixels, a power region outside the pixel area and configured to receive a power voltage, a plurality of photoelectric converters in the substrate and corresponding to the plurality of pixels, and a ground portion in the power region of the substrate;
• a dummy isolation pattern surrounding the ground portion and passing through the substrate;
• and
• a wiring layer on the substrate, wherein
• the ground portion is electrically insulated from the plurality of photoelectric converters by the dummy isolation pattern,
• the wiring layer further includes a first connection wiring structure and a second connection wiring structure,
• the first connection wiring structure overlaps the ground portion in a vertical direction,
• the first connection wiring structure is configured to receive a power voltage,
• the second connection wiring structure overlaps the plurality of photoelectric converters in the vertical direction,
• the second connection wiring structure electrically connects the substrate and the first connection wiring structure,
• the first connection wiring structure includes a first contact electrode, and
• the first contact electrode is electrically connected to the ground portion.

An image sensor comprising:

• a first chip including a first surface;
• and
• a second chip on the first chip and including a second surface, the second surface of the second chip facing the first surface of the first chip, wherein
• the first chip further includes a first connection pad on the first surface of the first chip,
• the second chip further includes transistors and a second connection pad electrically connected to the transistors,
• the second connection pad is on the second surface of the second chip,
• the first connection pad and the second connection pad are electrically connected to each other,
• the first chip further includes a substrate, a plurality of photoelectric converters in the substrate and corresponding to a plurality of pixel in a pixel area of the substrate, a pixel isolation pattern between the plurality of photoelectric converters, a ground portion in a peripheral area of the substrate, a dummy isolation pattern surrounding the ground portion and passing through the substrate, a wiring layer, a micro lens layer, and a first connection wiring structure,
• the substrate includes a third surface and a fourth surface facing opposite each other,
• the dummy isolation pattern is spaced apart from the pixel isolation pattern,
• the micro lens layer is on the fourth surface of the substrate in the pixel area,
• the first connection wiring structure is on the third surface of the substrate in the peripheral area and electrically connected to the second connection pad,
• the first connection wiring structure includes a plurality of connection wiring lines, a plurality of vias connecting the plurality of connection wiring lines, and a first contact electrode between the plurality of connection wiring lines and the ground portion, and
• the first connection wiring is electrically connected to the ground portion.