Optical sensor package with a substrate

A substrate, comprising:

• a piece of glass;
• a die attach pad disposed on a top surface of the piece of glass and configured to receive a semiconductor device die;
• a first inter-metal dielectric layer disposed adjacent to the die attach pad on the top surface;
• a second inter-metal dielectric layer disposed on a bottom surface of the piece of glass;
• and
• at least one through-glass via extending from the top surface of the piece of glass to the bottom surface of the piece of glass.

A method, comprising:

• disposing at least one inorganic substrate on a carrier, the at least one inorganic substrate including at least one through-substrate via extending from a first side to an opposite second side;
• forming wire bonds between an optical sensor die and traces and pads in a first inter-metal dielectric layer disposed on a first side of the at least one inorganic substrate;
• placing a cover over the optical sensor die;
• applying encapsulating material on vertical sides of the cover, the optical sensor die, and the at least one inorganic substrate, the encapsulating material joining several individual inorganic substrate substrates disposed on the carrier together;
• singulating through the encapsulating material to isolate individual inorganic substrates on the carrier;
• transferring the individual inorganic substrates in upside down position onto a die holder;
• and
• disposing solder bumps on a second inter-metal dielectric layer on the opposite second side of the individual inorganic substrates.