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US 2026/0090115 A1Published application
Photonic chips including a hybrid plasmonic photodetector
AssigneeGlobalFoundries U.S. Inc.
InventorYusheng Bian
Life of this patent
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Abstract
Structures for a photonic chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector including a pad, a semiconductor layer on the pad, and a metal layer that extends into the pad. The semiconductor layer may be configured to absorb light of a given wavelength.
Claims20
A structure for a photonic chip, the structure comprising:
- a photodetector including a pad, a semiconductor layer on the pad, and a first metal layer that extends into the pad, the semiconductor layer configured to absorb light of a given wavelength.
A method of forming a structure for a photonic chip, the method comprising:
- forming a pad of a photodetector;
- forming a semiconductor layer on the pad, wherein the semiconductor layer is configured to absorb light of a given wavelength;
- and
- forming a metal layer that extends into the pad.
1 more element
Dependencies are inferred from the claim text.