Electronic Device

An electronic device comprising:

• a substrate comprising:
• a first side;
• and
• a second side corresponding to the first side;
• a first metal layer disposed on the substrate;
• a first insulating layer disposed on the first metal layer;
• a second metal layer disposed on the first insulating layer;
• a third metal layer disposed on the second metal layer, wherein at least one portion of the third metal layer is configured to form at least one portion of an electrostatic discharge protection circuit;
• an electronic component comprising:
• a first terminal electrically connected to at least another portion of the third metal layer;
• a chip on film (COF) pad disposed on the first side of the substrate and electrically connected to the first metal layer and the second metal layer;
• and
• a flexible printed circuit (FPC) pad disposed on the second side of the substrate and electrically connected to at least another portion of the third metal layer.