Epitaxial features of semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Ching Chu, Chung-Chi Wen, Wei-Yuan Lu, Feng-Cheng Yang, Yen-Ming Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Ching Chu, Chung-Chi Wen, Wei-Yuan Lu, Feng-Cheng Yang, Yen-Ming Chen
Estimating the term…
A method for fabricating a semiconductor device that includes a merged source/drain feature extending between two adjacent fin structures is provided. An air gap is formed under the merged source/drain feature. Forming the epitaxial feature includes growing a first epitaxial feature having a first portion over the first fin structure and a second portion over the second fin structure, growing a second epitaxial feature over the first and second portions of the first epitaxial feature, and growing a third epitaxial feature over the second epitaxial feature. The second epitaxial feature includes a merged portion between the first fin structure and the second fin structure.
A semiconductor device, comprising:
A semiconductor device, comprising:
A method of semiconductor device fabrication, the method comprising:
Dependencies are inferred from the claim text.