Gate-all-around transistors and methods of forming
AssigneeApplied Materials, Inc.
InventorsBenjamin Colombeau, Balasubramanian Pranathathiharan, Lequn Liu
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AssigneeApplied Materials, Inc.
InventorsBenjamin Colombeau, Balasubramanian Pranathathiharan, Lequn Liu
Estimating the term…
Approaches herein provide devices and methods for forming optimized gate-all-around transistors. One method may include forming a plurality of nanosheets each comprising a plurality of alternating first layers and second layers, and etching the plurality of nanosheets to laterally recess the second layers relative to the first layers. The method may further include forming an inner spacer over the recessed second layers by forming a spacer material along an exposed portion of each of the plurality of nanosheets, etching the spacer material to remove the spacer material from the first layers of each of the plurality of nanosheets, and performing a sidewall treatment to the plurality of nanosheets after the spacer material is removed from the first layers of each of the plurality of nanosheets.
A device, comprising:
A gate-all-around device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.