Conductive film and electromagnetic wave shielding material using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorTomohiro FUKAO
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Abstract
One aspect of the present invention relates to a conductive film including: a thermosetting resin layer; and a conductive layer on at least a part of at least one surface of the thermosetting resin layer, in which the thermosetting resin layer has an elongation at break at 20° C. of 50% or more, a tensile modulus at 20° C. of 1.0 MPa or more and 200 MPa or less, and a storage modulus at 250° C. of 0.1 MPa or more and 200 MPa or less, a film thickness of the conductive layer is 0.1 μm or more and 3.0 μm or less, the conductive layer contains a metal complex, and the conductive layer has a surface resistivity of 1×10−2Ω/□ or more and 10 Ω/□ or less.
Claims8
A conductive film comprising:
- a thermosetting resin layer;
- and
- a conductive layer on at least a part of at least one surface of the thermosetting resin layer, wherein
- the thermosetting resin layer has an elongation at break at 20° C. of 50% or more, a tensile modulus at 20° C. of 1.0 MPa or more and 200 MPa or less, and a storage modulus at 250° C. of 0.1 MPa or more and 200 MPa or less,
- a film thickness of the conductive layer is 0.1 μm or more and 3.0 μm or less,
- the conductive layer contains a metal complex, and
- the conductive layer has a surface resistivity of 1×10−2Ω/□ or more and 10Ω/□ or less.
Dependencies are inferred from the claim text.